Corning 7980 Fused Silica
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Corning 7980 Fused Silica

Corning 7980, ArF Grade, is a high purity synthetic amorphous silicon dioxide manufactured by flame hydrolysis. The noncrystalline, colorless, silica glass combines a very low thermal expansion coefficient with excellent optical qualities and exceptional transmittance in the deep ultraviolet. ArF Grade was developed for 193 nm lithography systems.
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  • DLS-LHOP2024071101

  • C-Laser

General Introduction:
Corning 7980, ArF Grade, is a high purity synthetic amorphous silicon dioxide manufactured by flame hydrolysis. The noncrystalline, colorless, silica glass combines a very low thermal expansion coefficient with excellent optical qualities and exceptional transmittance in the deep ultraviolet. ArF Grade was developed for 193 nm lithography systems.
In order to satisfy the challenging quality requirements of our customers in leading edge applications such as microlithography, Corning is dedicated to continuous improvement. Our investments in research and develop- ment, combined with Corning's quality systems, support our technology leadership position and ensure that we meet our customer's requirements on time, every time.
Corning Ultra pure fused silica glass material HPFS 7980
Materials were first developed by Corning for US aerospace equipment, and then gradually used in commercial field. Corning has made a comparison between Schott's and Russia's corresponding materials. Corning's products have obvious advantages in uniformity and consistency. The most important thing is that Corning's products have very small and stable material stress in the case of similar optical and mechanical properties.

Products Name: Corning 7980 Fused Silica ArF Grade
Alias: HPFS Fused Silica ArF Grade 7980,Corning 7980, Corning 7980 fused silica, Corning 7980 fused silica ArF Grade, HPFS Corning 7980 fused silica, Corning 7980 semiconductor optics materials, etc

Optical and Thermal Properties:

Softening Point1585 ºC (107.6 poises)
Annealing Point1042 ºC (1013 poises)
Strain Point893 ºC (1014.5 poises)
Thermal Conductivity1.30 W/m K
Thermal Diffusivity0.0075 cm2/s
Average C.T.E.0.52 ppm/K 5 ºC-35 ºC
0.57 ppm/K 0 ºC-200 ºC
0.48 ppm/K -100 ºC-200 ºC


Mechanical Properties:

Elastic (Young's) Modulus72.7 GPa
Shear Modulus31.4 GPa
Average Modulus of Rupture, abraded52.4 MPa
Bulk Modulus35.4 GPa
Poisson's Ratio0.16
Density2.201 g/cm3
Knoop Hardness (100 g load)522 kg/mm2


Chemical Durability:

Solution
TimeWeight Loss [mg/cm2]
5% HCL by weight@95 ºC24 h< 0.010
5% NaOH@95 ºC6 h0.453
0.02N NA2CO3@95 ºC6 h0.065
0.02N H2SO4@95 ºC24 h< 0.010
Deionized H2O@95 ºC24 h0.015
10% HF by weight@25 ºC20 m0.230
10% NH4F*HF by weight@25 ºC20 m0.220


Main Applying Fields:

Applying Fields:Application of microlithography
Lithography lens,
Photomask substrate
Deep ultraviolet laser element
Optical standard parts
Excimer laser optics
Lithographic optics
Beam transmission element
Light guide
Laser fusion
Application of various aerospace technologies
*****other


Matching Custom Manufacturing Serivce:
Including Moulding, CNC machining, Polishing, Particle beam processing, Magnetic flux conversion processing, Grinding, Coating, Lightweighting, Custom Shaping, Counterbores, Drilling & Coring, Edge & Bevel Polishing,3D Contouring, Bevels & Chamfers, Steps & Slots, Laser Cutting & Marking, Metrology & Inspection, Precision Pitch Polishing, Double-Sided Polishing, Optical Assembly, Measuring, etc.
Matching processing equipments;
1).Single side lapping and polishing machines
2).Duble sided polishing machines
3).Ring throwing machines
4).DMG five-axis five-linkage spherical milling machine
5).DMG ultrasonic machining center
6).Super large scale gantry cnc machining center (2.0*2.0m)
7).Super large scale surface grinder (1.6m*1.6m)
8).CNC cutting machines
9).Thin plate cleaning machines
10).Ultrasonic trough cleaning machines
11).Plane interferometers
12).Two dimensional detectors
13).Ion beam polishing machines
14).Magnetorheological polishing equipments


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